The AMHS of semiconductor manufacturing plants is a large system that includes AMHS transmission hardware equipment (OHT, AGV/AMR, Lifter, etc.), storage equipment (Foup&Reticle Stocker, Reticle Cabinet, NTB, OHCV, OHB), purification equipment (TLP, OPS, FPS, etc.), and software systems (MCS, OHTC, STKC, etc.). The AMHS scheme is mainly divided into three types: aerial overhead crane handling system (OHT), clean storage system (STK), and mobile robot (AGV) ground scheme.
The Overhead Hoist Transport (OHT) system consists of transport vehicles (VHL), guide rails, Overhead Buffers (OHB), Maintenance Lifts (MTL), Contactless Power Supply systems (CPS), and other components.
The average travel speed of OHT vehicles reaches 5 m/s (18 km/h) on straight rails and 1 m/s (3.6 km/h) on curved rails.
Wireless communication transmits real-time vehicle data to the central server hosted within the Overhead Hoist Transport Control (OHTC) system. This system creates a complete operational visualization of every piece of equipment across the semiconductor fab, similar to a city traffic control center monitoring urban traffic flow. Beyond tracking overall OHT throughput, the integrated control system also captures real-time waiting duration data for each individual transport vehicle.



Wafer dicing machines cut polished wafers into individual dies, with their precision and efficiency governing chip quality and production cost. They are classified into abrasive and laser types. Featuring low cost and high efficiency, the abrasive dicing machine integrates multiple precision control technologies and is suitable for thick wafer processing.
Servotronix supplies a full suite of core motion components including motion controllers, servo drives and servo motors. The motion controller is required to remotely read and parse trajectory files (.Dat) generated by the host PC, and high-speed communication is essential for mass data exchange between the host and slave devices.
The upper-level control system generates dicing trajectory data based on the dimensional specifications of chips under production. The MC703 controller retrieves such files via remote file sharing and performs data parsing, which imposes stringent demands on the speed and stability of data transmission. The trajectory data is then transmitted from the controller down to servo drives to execute machining operations, with exacting requirements placed on precision and dynamic response during start-stop and blade lifting movements.


Die bonder, also known as die attach machine, is the most critical and core equipment for the die attach process in semiconductor packaging and testing. It picks individual die from diced wafers and places them onto the corresponding die flag of the substrate, then bonds the die to the substrate with epoxy adhesive. The die bonder achieves high-speed and high-precision component placement, and performs key processes including positioning, alignment, flip chip bonding and continuous die attach.


